About Metasilicon
Beyond Innovation · Customer Success · Teamwork · Technology for Good
Founded in November 2021, MetaSilicon leverages leading core technologies—including edge AI, LOFIC fusion sensing, computational optics, and high-speed, high-precision ADC—to develop high-performance video CIS chips for the new intelligent era. Our solutions target automotive & robotics, consumer electronics, industrial, and emerging AI applications. Headquartered in Shenzhen, we operate R&D centers in Shanghai, Chengdu, Xi’an, and Silicon Valley. MetaSilicon is the world’s only image sensor provider to successfully integrate 2D LOFIC technology into automotive-grade SoC CIS.
As of February 2026, we have surpassed 100 million cumulative CIS shipments and set multiple industry records—achieving the fastest time-to-market, mass shipments, 10 million-unit milestone, and RMB 100 million in revenue among global image sensor design houses.
As of February 2026, we have surpassed 100 million cumulative CIS shipments and set multiple industry records—achieving the fastest time-to-market, mass shipments, 10 million-unit milestone, and RMB 100 million in revenue among global image sensor design houses.
Position
The professional large chip team in the new intelligent era builds the excellent large chip platform in the new intelligent era.
Mission
Bring high-quality images to everyone and devices, conveying emotion and happiness.
Vision
Building a better Metaverse.
Milestone
<< Learn more
Contact MetaSilicon
China · ShenzhenChina · ShanghaiChina · ChengduChina · Xi'anUSA · Silicon ValleySouth Korea · Gyeonggi-do
China
Shenzhen
Shenzhen
Headquarters
Address:
Room 1601–1604, 16th Floor, Building 12A, Shenzhen Bay Technology Eco-Park, Nanshan District, Shenzhen, China
