PRODUCTS CENTER
On-board CIS
As the core component of the car perception layer, the Meta Silicon on-board image sensor product converts the real world into image information, providing guarantee for the vehicle to understand the surrounding environment and formulate driving operations, and providing accurate, timely and sufficient basis for the decision of the advanced driving assistance system.
ISP
The 3D image sensor chip uses infrared light, and uses the time of flight (ToF) measurement principle: for each pixel, the 3D image sensor chip will measure the time of infrared light to and from the camera and the object. At the same time, each pixel will also detect the brightness value of the object.
Others
The 3D image sensor chip uses infrared light, and uses the time of flight (ToF) measurement principle: for each pixel, the 3D image sensor chip will measure the time of infrared light to and from the camera and the object. At the same time, each pixel will also detect the brightness value of the object.
INDUSTRY APPLICATION
ABOUT US
MetaSilicon is an edge computing chip design company focusing on building an intelligent world. Based on leading end-to-end AI, high-precision ADC, computational optics, stacking sensor and other core technologies; Develop new generation CIS and other chips based on AI acceleration for automotive, medical, industrial, AR&VR and other scenarios. The company's technical team members are from leading semiconductor companies in the industry, and the core team members have 15+years of chip industry experience. The company's operation headquarters is located in Shenzhen, China, and its R&D is located in Shanghai, Chengdu and overseas.
